104977

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Description: Active Cooler LGA1700 incl. Backplate Hersteller: HSM ZAMECKI Matchcode: S3SA-DSD1-E121Z Rutronik No.: DISACC1632 VPE: 1 MOQ: 1 Verpackung: BOX

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Parameter

Cooling solutio: ACTIVE
Fan connector: 4-PIN PWM
Heatpipe incl.: Y Y/N
Mounting: SCREWS
Chassis height: 4U
Accessory: BACKPLATE
Socket type: LGA1700
Cooler material: COMPOUND
Height: 100 mm
Width: 92 mm
Length: 95 mm
Weight: 500 G
Matching board: DISACC1751
Automotive: NO
RoHS Status: RoHS-conform
Verpackung: BOX

ECCN: EAR99
Zolltarifnummer: 84733080000
Land: Taiwan
Lieferzeit beim Hersteller: 15 Wochen

Beschreibung

Active cooling solution designed for Alder Lake / Raptor Lake processors based on the LGA1700 socket. The 3U active aluminum heatsink with copper base and 4 heat pipes consists of Cooler and Backplate.

Characteristics:

Heatsink Material: Aluminum with copper base and 4 heat pipes
Fastener: Screw & Spring
PWM Fan: F129025BUAF4Q8aR with two ball bearing
Fan Speed: 800 - 3450 rpm, Air Flow: 16.29 - 70.24 CFM, Noise Level: 21 - 43 dB-A
Dimensions (L x W x H): 95 x 92 x 103 [mm]
Weight: 457 g
Thermal Material: X23-7762
Thermal Resistance: 0.152 °C/W
RoHS & REACh compliant
Made in PRC